Field Modeling of the Influence of Defects Caused by Bending of Conductive Textronic Layers on Their Electrical Conductivity.

One of the critical parameters of thin-film electrically conductive structures in wearable electronics systems is their conductivity. In the process of using such structures, especially during bending, defects and microcracks appear that affect their electrical parameters. Understanding these phenomena in the case of thin layers made on flexible substrates, including textile ones, which are incorporated in sensors that monitor vital functions, is a key aspect when applying such solutions.