The thermal stability and degradation mechanism of Cu/Mo nanomultilayers.

The microstructural evolution of Cu/Mo nanomultilayers upon annealing was investigated by X-ray diffraction and transmission electron microscopy. The isothermal annealing process in the temperature ranges of 300-850°C was conducted to understand the thermal behavior of the sample and follow the transformation into a nanocomposite. Annealing at 600°C led to the initiation of grain grooving in the investigated nanomultilayer, and it degraded into a spheroidized nanocomposite structure at 800°C.

Tailoring Fast Directional Mass Transport of Nano-Confined Ag-Cu Alloys upon Heating: Effect of the AlN Barrier Thickness.

This study addresses the phase stability and atomic mobility of Ag-Cu nano-alloys confined by AlN in a nanomultilayered configuration during thermal treatment. To this end, nanomultilayers (NMLs) with a fixed Ag-Cu nanolayer thickness of 8 nm and a AlN barrier nanolayer with variable thickness of 4, 8, or 10 nm were deposited by magnetron sputtering on sapphire substrates and subsequently isothermally annealed for 5 or 20 min in air in the range of 200-500 °C. The microstructure of the as-deposited and heat-treated NMLs was analyzed by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, and energy dispersive spectroscopy.

Torsional shear strength of steel joined with high performance aerospace adhesives at cryogenic and elevated temperatures.

Pure torsional shear tests of joints glued with two different aerospace grade adhesives were performed using a specifically designed and constructed torsional shear test equipment. The developed test equipment allows for measuring of pure torsional shear strength under cryogenic and at elevated temperature conditions. The adhesives Hysol EA 9321 and 3M Scotch-Weld EC-9323-2 B/A were used to join steel torsional shear test specimens.

Modeling of Interface and Internal Disorder Applied to XRD Analysis of Ag-Based Nano-Multilayers.

Multilayered structures are a promising route to tailor electronic, magnetic, optical, and/or mechanical properties and durability of functional materials. Sputter deposition at room temperature, being an out-of-equilibrium process, introduces structural defects and confers to these nanosystems an intrinsic thermodynamical instability. As-deposited materials exhibit a large amount of internal atomic displacements within each constituent block as well as severe interface roughness between different layers.

Synthesis and thermodynamics of Ag-Cu nanoparticles.

Metallic silver, copper, and Ag-Cu nanoparticles (NPs) have been produced by a chemical reduction method. The obtained nanoparticles were characterized by powder X-ray diffraction (XRD) and transmission electron microscopy (TEM). A side-segregated configuration was observed for the one-pot synthesized Ag-Cu NPs, and the melting temperature depression of about 14 °C was found by differential scanning calorimetry (DSC).

Benign joining of ultrafine grained aerospace aluminum alloys using nanotechnology.

Ultrafine grained aluminum alloys have restricted applicability due to their limited thermal stability. Metalized 7475 alloys can be soldered and brazed at room temperature using nanotechnology. Reactive foils are used to release heat for milliseconds directly at the interface between two components leading to a metallurgical joint without significantly heating the bulk alloy, thus preserving its mechanical properties.