Effect of crystallographic orientation on subcritical grain boundary cracking in a conventionally cast polycrystalline nickel-based superalloy.

The role of grain orientation and grain boundary misorientation on the formation of subcritical grain boundary cracks in creep of a conventionally cast nickel-based superalloy has been studied. The crystallographic orientations of the grains adjacent to grain boundaries normal to the tensile axis were measured using electron backscattered diffraction. The difference in the Schmid factor for the {111} <112> slip system between the grains was compared to the occurrence of grain boundary cracking.

Note: Thermal analog to atomic force microscopy force-displacement measurements for nanoscale interfacial contact resistance.

Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic force microscopy tips were performed to determine the contact resistance between an organic thin film and Si. The measurement methodology presented demonstrates how the thermal contrast signal obtained during a force-displacement ramp is used to quantify the resistance to heat transfer through an internal interface. The results also delineate the interrogation thickness beyond which thermal diffusion in the organic thin film is not affected appreciably by the underlying substrate.