Etching Chemistry Process Optimization of Ethylene Diluted with Helium (CH/He) in Interconnect Integration.

This study explores the effects of different passivation gases on the properties of polymers formed on aluminum (Al) sidewalls during the etching process in Al-based interconnect structures. The research compares the use of nitrogen (N) and ethylene diluted with helium (CH/He) as passivation gases, focusing on the resulting polymer's composition, thickness, and strength, as well as the levels of residual chlorine post-etch. The findings reveal that using CH leads to the formation of a thinner, weaker polymer with lower chlorine residue compared to the thicker, stronger polymer formed with N.

In Situ Pre-Metallization Cleaning of CoSi Contact-Hole Patterns with Optimized Etching Process.

We examined how controlling variables in a pre-metallization Ar sputter-etching process for in situ contact-hole cleaning affects the contact-hole profile, etching rate, and substrate damage. By adjusting process parameters, we confirmed that increasing plasma power lowered the DC bias but enhanced the etching rate of SiO, while increasing RF power raised both, with RF power having a more pronounced effect. Higher Ar flow rate reduced etching uniformity and slightly lowered the DC bias.

Fabrication of Electrospun Porous TiO Dielectric Film in a Ti-TiO-Si Heterostructure for Metal-Insulator-Semiconductor Capacitors.

The development of metal-insulator-semiconductor (MIS) capacitors requires device miniaturization and excellent electrical properties. Traditional SiO gate dielectrics have reached their physical limits. In this context, high-k materials such as TiO are emerging as promising alternatives to SiO.

Capacitance-Voltage Fluctuation of SiN-Based Metal-Insulator-Metal Capacitor Due to Silane Surface Treatment.

In this study, we analyze metal-insulator-metal (MIM) capacitors with different thicknesses of SixNy film (650 Å, 500 Å, and 400 Å) and varying levels of film quality to improve their capacitance density. SixNy thicknesses of 650 Å, 500 Å, and 400 Å are used with four different conditions, designated as MIM (N content 1.49), NEWMIM (N content 28.

Enhanced Hybrid Nanogenerator Based on PVDF-HFP and PAN/BTO Coaxially Structured Electrospun Nanofiber.

Nanogenerators have garnered significant interest as environmentally friendly and potential energy-harvesting systems. Nanogenerators can be broadly classified into piezo-, tribo-, and hybrid nanogenerators. The hybrid nanogenerator used in this experiment is a nanogenerator that uses both piezo and tribo effects.

Advancements in Flexible Nanogenerators: Polyvinylidene Fluoride-Based Nanofiber Utilizing Electrospinning.

With the gradual miniaturization of electronic devices and the increasing interest in wearable devices, flexible microelectronics is being actively studied. Owing to the limitations of existing battery systems corresponding to miniaturization, there is a need for flexible alternative power sources. Accordingly, energy harvesting from surrounding environmental systems using fluorinated polymers with piezoelectric properties has received significant attention.