High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating.

This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes.

A novel method to detect wafer-bonding energy using function fitting.

The bonding energy is an important parameter to evaluate the quality of bonded wafers in the semiconductor industry. The most important currently used method to measure the bonding energy is the so-called crack opening method. Unfortunately, the infrared cameras used for the wafer inspection with this method have limiting resolutions, and the derived direct crack length reading error is relatively large.