Nonthermal Effect of Microwave Processing Enhances Interface Reactivity and Microchannel Integrity: Low-Temperature Rapid Bonding of PMMA Microfluidic Devices.

As a nonthermal approach, microwave processing significantly enhances interface reactivity and preserves microchannel integrity during the bonding of poly(methyl methacrylate) (PMMA) microfluidic devices. By activating and aligning polymer chains at lower temperatures, this method promotes rapid bonding and improved interfacial adhesion, maintaining the precision of delicate microstructures essential for device functionality. Unlike thermal wafer bonding, which relies on elevated temperatures that may risk deforming delicate microstructures, the nonthermal effect of microwaves facilitates the activation and alignment of polymer chains at lower temperatures, enhancing interfacial adhesion through improved molecular interactions.