Broadband Lumped-Element Parameter Extraction Method of Two-Port 3D MEMS In-Chip Solenoid Inductors Based on a Physics-Based Equivalent Circuit Model.

Integrated 2D spiral inductors possess low inductance per unit area, which limits their application range. However, the state of investigation into the lumped-element parameter extraction method for integrated 3D in-chip multi-turn solenoid inductors, which possess higher inductance per unit area, is inadequate. This type of inductor can thus not be incorporated into fast computer-aided design (CAD)-assisted circuit design.

Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure.

In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The parameters influencing the properties and processing speed were analyzed.