Effects on the Thermo-Mechanical and Interfacial Performance of Newly Developed PI-Sized Carbon Fiber-Polyether Ether Ketone Composites: Experiments and Molecular Dynamics Simulations.

In this study, polyether ether ketone (PEEK) composites reinforced with newly developed water-dispersible polyimide (PI)-sized carbon fibers (CFs) were developed to enhance the effects of the interfacial interaction between PI-sized CFs and a PEEK polymer on their thermo-mechanical properties. The PI sizing layers on these CFs may be induced to interact vigorously with the p-phenylene groups of PEEK polymer chains because of increased electron affinity. Therefore, these PI-sized CFs are effective for improving the interfacial adhesion of PEEK composites.

Structural Effect of Polyimide Precursors on Highly Thermally Conductive Graphite Films.

In this study, polyimide (PI) with high carbonization yield was used as a precursor to prepare graphite films with high thermal conductivity. The crystallinity, grain size, and thermal conductivity of the graphite films were characterized and found to vary according to the chemical structure of the PI precursor. Aromatic PIs containing ortho-substituted hydroxyl groups in the PI main chain (DHB-BPDA) were synthesized by the polycondensation reaction of 3,3'-dihydroxybenzidine (DHB) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA).

Analysis of the effect of organic solvent-sheet interfacial interaction on the exfoliation of sulfur-doped reduced graphene oxide sheets in a solvent system using molecular dynamics simulations.

In this study, the effect of interfacial interaction between solvent and sheets on the exfoliation of sulfur-doped reduced graphene oxide (SrGO) sheets was studied, using molecular dynamics simulations. Four organic solvents of toluene, tetrahydrofuran, N-methyl-2-pyrrolidone, and sulfolane, were used in this simulation. An insertion simulation considering the size effect of insertion molecules was used to determine the insertion efficiency of the solvent molecules.