A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.

This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production.

Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study.

Microchannels with integrated pillars have enhanced the production capabilities and performance of various applications due to their high surface-to-volume ratio. However, emerging gas bubbles can become trapped, potentially limiting the functionality or efficiency of the device when scaled down to the low-micrometer scale. Understanding the conditions required to dislodge these bubbles is thus critical for optimizing microfluidic devices with complex physical behaviors.