Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication.

The diffusion-bonding technique has been utilized to join various Al alloys (AA1060, AA2024, AA3003) to Cu for bimetallic anode application. This process aims to achieve robust metallic continuity to facilitate electron transfer, while carefully managing the growth of the intermetallic layer at the bonding interface. This control preserves the active volume of aluminum and prevents excessive brittleness of the anode.

Exploring FAST Technique for Diffusion Bonding of Tungsten to EUROFERE97 in DEMO First Wall.

The European Fusion Reactor (DEMO, Demonstration Power Plant) relies significantly on joining technologies in its design. Current research within the EUROfusion framework focuses on developing materials for the first wall and divertor applications, emphasizing the need for suitable joining processes, particularly for tungsten. The electric field-assisted sintering technique (FAST) emerges as a promising alternative due to its high current density, enabling rapid heating and cooling rates for fast sintering or joining.