A new type of UV-curable pressure-sensitive adhesive containing Si atoms (Si-PSAs) was prepared by a solution-free UV-initiated telomerization process of n-butyl acrylate, acrylic acid, methyl methacrylate, and 4-acrylooxybenzophenone using triethylsilane (TES) as a telogen and an acylphosphine oxide (APO) as a radical photoinitiator. Selected commercial adhesion promoters were tested as additives in the formulation of adhesive compositions, i.e.
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