For applications as high-brightness light-emitting-diodes, a bow-free freestanding gallium nitride (GaN) wafer 2 inch in diameter and ∼185 μm in thickness was fabricated by process-designing pit and mirror GaN layers grown hydride-vapor-phase epitaxy, laser lift-off, N-face polishing of the pit GaN layer, and three-step polishing of the mirror GaN layer using 3.0 μm-, 0.5 μm-, and 50 nm-diameter diamond abrasives and by inductively-coupled-plasma reactive-ion etching.
View Article and Find Full Text PDFSilicon solar cells mainly absorb visible light, although the sun emits ultraviolet (UV), visible, and infrared light. Because the surface reflectance of a textured surface with SiNX film on a silicon solar cell in the UV wavelength region (250-450 nm) is higher than ∼27%, silicon solar-cells cannot effectively convert UV light into photo-voltaic power. We implemented the concept of energy-down-shift using CdSe/ZnS core/shell quantum-dots (QDs) on p-type silicon solar-cells to absorb more UV light.
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