Nanoscale-Dewetting-Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing.

As electronics dramatically advance, their components should be fabricated for miniaturized scale, and integrated on limited-size substrates with extremely high density. Current technologies for the integration and interconnection of electronics show some critical limitations in the application of microscale electronics. To address these problems, herein, a new direct and vertical interconnection driven by selective dewetting of a polymer adhesive is introduced.