Publications by authors named "J V Bondareva"

The diamond industry has long been associated with environmental and social problems, ranging from mining practices to ethical concerns related to diamond sourcing. In recent years, there has been a growing interest in lab-grown diamonds as a sustainable alternative for diamond consumers. However, the production of lab-grown diamonds has own challenges.

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Extraordinary properties of two-dimensional materials make them attractive for applications in different fields. One of the prospective niches is optical applications, where such types of materials demonstrate extremely sensitive performance and can be used for labeling. However, the optical properties of liquid-exfoliated 2D materials need to be analyzed.

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Dental implants are thought to be implanted for life, but throughout their lifespan, they function in aggressive oral environment, resulting in corrosion of the material itself as well as possible inflammation of adjacent tissues. Therefore, materials and oral products for people with metallic intraoral appliances must be chosen carefully. The purpose of this study was to investigate the corrosion behavior of common titanium and cobalt-chromium alloys in interaction with various dry mouth products using electrochemical impedance spectroscopy (EIS).

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The study reveals the polymer-crosslinker interactions and functionality of hydrophilic nanofibers for antibacterial wound coatings. Coaxial electrospinning leverages a drug encapsulation protocol for a core-shell fiber composite with a core derived from polyvinyl alcohol and polyethylene glycol with amorphous silica (PVA-PEG-SiO), and a shell originating from polyvinyl alcohol and graphene oxide (PVA-GO). Crosslinking with GO and SiO initiates the hydrogel transition for the fiber composite upon contact with moisture, which aims to optimize the drug release.

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The efficiency of electronic microchip-based devices increases with advancements in technology, while their size decreases. This miniaturization leads to significant overheating of various electronic components, such as power transistors, processors, and power diodes, leading to a reduction in their lifespan and reliability. To address this issue, researchers are exploring the use of materials that offer efficient heat dissipation.

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