Tin (Sn)-based two-dimensional (2D) materials exhibit intriguing mechanical and optoelectrical properties owing to their non-centrosymmetric crystallinity and tunable band structures. A judicious integration of these individually decoupled properties is projected to introduce unparalleled functionalities into them, which remain largely unexplored. Herein, we develop wafer-scale tin selenide (SnSe, 0 < < 1) 2D layers composed of thermodynamically stable coexisting phases of SnSe and SnSe with distinct functionalities and identify a strong interplay between their mechanical and optoelectrical characteristics.
View Article and Find Full Text PDFWe present a method to model photonic components in Verilog-A by introducing bidirectional signaling through a single port. To achieve this, the concept of power waves and scattering parameters from electromagnetism are employed. As a consequence, one can simultaneously transmit forward and backward propagating waves on a single wire while also capturing realistic, measurement-backed responses of photonic components in Verilog-A.
View Article and Find Full Text PDFThe congenital condition gastroschisis is associated with delayed villous development and placental malperfusion, suggesting placental involvement. This study uses RNA sequencing to compare the placental transcriptome in pregnancies with and without gastroschisis. 180 coding genes were differentially expressed, mapping to multiple gene ontology pathways.
View Article and Find Full Text PDFStray light in an optical system is unwanted parasitic light that may degrade performance. It can originate from different sources and may lead to different problems in the optical system such as fogging, ghost images for imagers, or inaccurate measurements for time of flight applications. One of the root causes is the reflectivity of the sensor itself.
View Article and Find Full Text PDFFabrication variability significantly impacts the performance of photonic integrated circuits (PICs), which makes it crucial to quantify the impact of fabrication variations before the final fabrication. Such analysis enables circuit and system designers to optimize their designs to be more robust and obtain maximum yield when designing for manufacturing. This work presents a simulation methodology, Reduced Spatial Correlation Matrix-based Monte-Carlo (RSCM-MC), to efficiently study the impact of spatially correlated fabrication variations on the performance of PICs.
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