Thermal Transport and Mechanical Stress Mapping of a Compression Bonded GaN/Diamond Interface for Vertical Power Devices.

Bonding diamond to the back side of gallium nitride (GaN) electronics has been shown to improve thermal management in lateral devices; however, engineering challenges remain with the bonding process and characterizing the bond quality for vertical device architectures. Here, integration of these two materials is achieved by room-temperature compression bonding centimeter-scale GaN and a diamond die via an intermetallic bonding layer of Ti/Au. Recent attempts at GaN/diamond bonding have utilized a modified surface activation bonding (SAB) method, which requires Ar fast atom bombardment immediately followed by bonding within the same tool under ultrahigh vacuum (UHV) conditions.

Characterization of Anomalous Grains in FeCo Magnetic Alloys.

Heat-treated FeCo-based magnetic alloys were characterized using a suite of electron microscopy techniques to gain insight into their structural properties. Electron channeling contrast imaging (ECCI) in the scanning electron microscope (SEM) found unique grains towards the outer edge of a FeCo sample with nonuniform background contrast. High-magnification ECCI imaging of these nonuniform grains revealed a weblike network of defects that were not observed in standard uniform background contrast grains.

Self-Assembled Complex Three-Phase Core-Shell Nanostructure of Au-CoFe-TiN with a Magneto-Optical Coupling Effect.

Nanostructured plasmonic-magnetic metamaterials have gained great research interest due to their enhanced magneto-optical coupling effects. Here, we report a complex three-phase nanocomposite design combining ferromagnetic CoFe with plasmonic TiN and Au as a multifunctional hybrid metamaterial using either a cogrowth or a templated method. Via the first method of cogrowing three phases, three different morphologies of Au-CoFe core-shell nanopillars were formed in the TiN matrix.