Perpendicular magnetic anisotropy in half-metallic thin-film CoCrAl.

Magnetocrystalline anisotropy (MCA) is one of the key parameters investigated in spin-based electronics (spintronics), e.g. for memory applications.

Half-metallicity in CrAl-terminated CoCrAl thin film.

Half-metals with high Curie temperature are ideal candidates for applications in spin-based electronics-an emerging technology utilizing a spin degree of freedom in electronic devices. Many half-metallic materials have been predicted theoretically, and some have been confirmed experimentally. At the same time, in thin-film geometry the electronic structure of these materials may change due to the potential presence of surface/interface states.

Structural and magnetic properties of bulk MnPtSn.

Interplay between structural and magnetic order parameters is one of the key mechanisms of tuning properties of materials intended for device applications in spintronics. Here, using density functional calculations, we study combined effects of tetragonal distortion and non-collinear magnetic order in MnPtSn. We show that this material has two energetically close energy minimums corresponding to tetragonal lattice.

Effects of pressure and strain on spin polarization of IrMnSb.

A high degree of spin polarization in electron transport is one of the most sought-after properties of a material which can be used in spintronics-an emerging technology utilizing a spin degree of freedom in electronic devices. An ideal candidate to exhibit highly spin-polarized current would be a room temperature half-metal, a material which behaves as an insulator for one spin channel and as a conductor for the other spin channel. In this paper, we explore a semi-Heusler compound, IrMnSb, which has been reported to exhibit pressure induced half-metallic transition.

Innovative pressure sensor platform and its integration with an end-user application.

This paper describes the fully integration of an innovative and low-cost pressure sensor sheet based on a bendable and printed electronics technology. All integration stages are covered, from most low-level functional system, like physical analog sensor data acquisition, followed by embedded data processing, to end user interactive visual application. Data acquisition embedded software and hardware was developed using a Rapid Control Prototyping (RCP).