Effect of Plating Layers on the Bonding Strength of -Type Bi-Te Thermoelectric Elements.

In thermoelectric modules, multiple -type and -type thermoelectric elements are electrically connected in series on a Cu electrode that is bonded to a ceramic substrate. Defects in the bond between the thermoelectric elements and the Cu electrode could impact the performance of the entire thermoelectric module. This study investigated the effect of plating layers on the bonding strength of -type Bi-Te thermoelectric elements.

Effect of the Electroless Nickel, Electroless Palladium, and Immersion Gold Multilayer as a Diffusion Barrier on the Bonding Strength of BiTe-Based Thermoelectric Modules.

An effective diffusion barrier layer was coated onto the surface of BiTe-based materials to avoid the formation of brittle intermetallic compounds (IMCs) by the diffusion of the constituents of Sn-based solder alloys into the BiTe-based alloys. In this study, the electrochemical deposition of multi-layers, i.e.

Effect of Etching Time and Temperature on Plating Adhesion of Acrylonitrile Butadiene Styrene (ABS)-Based Material.

In this study, the effects of etching time and temperature on the adhesion of plated layers of acrylonitrile butadiene styrene (ABS) were investigated. The ABS surface micropores, which act as anchors to improve the adhesion of the plated layer, increased in numbers as the etching temperature increased. Adhesion was maximum at the etching time of 9 min at etching temperatures of 60 and 70 °C.

Acid Palladium-Nickel Electroplating Using Ethylenediamine as Complexing Agent.

In the present study, an acidic palladium-nickel alloy plating solution was prepared with ethylenediamine as the complexing agent, and the physical properties of the alloy plating layer were investigated. The palladium-nickel alloy plating layer could be deposited over a broad range of current densities as the deposition potential of palladium in the solution containing ethylenediamine significantly shifted toward the base direction and the value was similar to that of nickel. X-ray diffraction patterns confirmed that the palladium-nickel alloy existed as a single-phase solid solution in the prepared alloy.

Effects of the Process Conditions on the Color of Dye-Treated Anodized AA5052.

This study investigated the effects of process conditions (anodization time, coloring treatment time, dye concentration) on the color of dye-treated anodized aluminum alloy 5052 (AA5052). The color change of the anodic layers and amount of dye adsorbed were quantitatively analyzed using a UV-vis spectrophotometer. The color of the anodic layer turned darker as the anodizing time, coloring treatment time, and dye concentration increased due to the amount of dye adsorbed by the layers.

Self-Propagating Heat Synthetic Reactivity of Fine Aluminum Particles via Spontaneously Coated Nickel Layer.

Aluminum powders are known to provide outstanding volumetric exothermic enthalpy energy during thermal oxidation. However, the amount of energy released tends to be limited by the dense surface oxide (AlO) layer of the powder. Hence, a prerequisite for improving the reactivity of passivated Al particles is to remove the AlO film from the surface.

Wet Etching Method for Electroless Ni-P Plating of Bi-Te Thermoelectric Element.

In this study, a method for electroless Ni-P plating with excellent adhesion via chemical wet etching to fabricate Bi-Te thermoelectric modules is proposed. The electroless Ni-P plating formed through the proposed method showed excellent adherence without peeling, even under heat treatment of 200 °C for 24 h. Wet etching and electroless Ni-P plating was performed on a Bi-Te thermoelectric module, which showed the excellent bond strength of approximately 10 MPa.

Fabrication of a Bi₂Te₃-Based Thermoelectric Module Using Tin Electroplating and Thermocompression Bonding.

A method for directly bonding thermoelectric elements onto copper electrodes without applying a solder paste was developed in this study. A tin coating of thickness approximately 50 m was deposited via electroplating onto the surface of a Bi₂Te₃-based thermoelectric element, which had a nickel diffusion barrier layer. The resulting structure was subsequently subjected to direct thermocompression bonding at 250 °C on a hotplate for 3 min at a pressure of 1.

Fabrication of an Aluminum-Based Thermoelectric Module Substrate via Anodization and Nickel Plating.

In this study, a thermoelectric module substrate was fabricated by subjecting an aluminum plate to a surface treatment process. To achieve this, the aluminum-based substrate was carried out to electrolytic etching, anodization, and Ni plating. The anodization of aluminum created an oxide film, which served as an insulation layer, while the Ni plating formed a conductive circuit layer.

A Novel Fabrication Method of Bi₂Te₃-Based Thermoelectric Modules by Indium Electroplating and Thermocompression Bonding.

In this study, we devised a method to bond thermoelectric elements directly to copper electrodes by plating indium with a relatively low melting point. A coating of indium, ~30 μm in thickness, was fabricated by electroplating the surface of a Bi2Te3-based thermoelectric element with a nickel diffusion barrier layer. They were then subjected to direct thermocompression bonding at 453 K on a hotplate for 10 min at a pressure of 1.

Fabrication of Aluminum-Based Thermal Radiation Plate for Thermoelectric Module Using Aluminum Anodic Oxidization and Copper Electroplating.

In this study, electrolytic etching, anodic oxidation, and copper electroplating were applied to aluminum to produce a plate on which a copper circuit for a thermoelectric module was formed. An oxide film insulating layer was formed on the aluminum through anodic oxidation, and platinum was coated by sputtering to produce conductivity. Finally, copper electroplating was performed directly on the substrate.