Simple fabrication of a double-layer multi-channel optical waveguide using passive alignment.

This study proposes a simple and cost-effective method of fabricating a double-layer polymeric optical waveguide, using two hot-embossing processes with a single stamp and template for passive alignment between the top and bottom layers. The two hot-embossing processes were conducted sequentially on the top layer and the bottom layer of the polymer layer. The second hot-embossing process was conducted after fabricating the buffer layer on the surface of the polymeric channel structure to control deformation and destruction of the previously fabricated polymeric channel structure.

Fabrication of thermally stable and cost-effective polymeric waveguide for optical printed-circuit board.

A thermally stable polymeric optical waveguide has been fabricated using ultraviolet (UV)-curable epoxy resins for the core and clad materials. A simple and cost-effective fabrication method that uses reusable polydimethylsiloxane (PDMS) masters has been developed. The 12-channel under-clad layer of the UV-cured epoxy was prepared using a PDMS master whose embossed channels had been fabricated by a polycarbonate (PC) secondary master.

Interchip link system using an optical wiring method.

A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices.

Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots.

A practical optical backplane system was prepared with transmitter-receiver processing boards and an optical backplane made from polymeric-waveguide-embedded optical printed-circuit boards. Optical slots were used as connection components between the transmitter-receiver processing boards and the backplane board to permit easy and repeatable insertion and extraction of the boards with micrometer precision. We report 10 Gbit/s data transmission between an optical backplane and the transmitter-receiver processing boards.