Publications by authors named "Igor Kostolny"
Article Synopsis
- The research investigated how well SiC ceramics can be soldered using a specific active solder (Sn5Sb3Ti) in a vacuum using electron beam heating.
- The solder has a narrow melting range and only one observed thermal behavior, with the solder becoming liquid at around 243 °C.
- Optimal soldering was achieved at 950 °C with a best wetting angle of 33°, and bonds formed between SiC and the solder due to reactions involving titanium and nickel, resulting in new phases that enhance bond strength, peaking at 40 MPa at 850 °C.
The aim of this research was to characterize soldering alloys of the type Sn-Sb-Ti and to study the ultrasonic soldering of SiC ceramics with a metal-ceramic composite of the type Cu-SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti(Sb,Sn) phase and the sharp-edged constituents of the TiSbSn phase are precipitated.
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