Wafer map failure pattern classification using geometric transformation-invariant convolutional neural network.

Wafer map defect pattern classification is essential in semiconductor manufacturing processes for increasing production yield and quality by providing key root-cause information. However, manual diagnosis by field experts is difficult in large-scale production situations, and existing deep-learning frameworks require a large quantity of data for learning. To address this, we propose a novel rotation- and flip-invariant method based on the labeling rule that the wafer map defect pattern has no effect on the rotation and flip of labels, achieving class discriminant performance in scarce data situations.