Microstructural characterization of gadolinium-rich phases in titanium alloys.

This study explores the microstructural characteristics of gadolinium (Gd)-rich phases in titanium (Ti) alloys through comprehensive electron microscopy analysis. The Ti alloys were produced using plasma arc melting and subsequently hot-forged. Elaborate material characterization, including scanning electron microscopy, electron backscatter diffraction, and energy dispersive spectroscopy, revealed the formation of round or angular Gd oxides and elongated Gd-rich grains within the alloy.

Copper Alloy Design for Preventing Sulfur-Induced Embrittlement in Copper.

This study presents an experimental approach to address sulfur-induced embrittlement in copper alloys. Building on recent theoretical insights, we identified specific solute elements, such as silicon and silver, known for their strong binding affinity with vacancies. Through experimental validation, we demonstrated the effectiveness of Si and Ag in preventing sulfur-induced embrittlement in copper, even though they are not typical sulfide formers such as zirconium.

A quantitative evaluation of microstructure by electron back-scattered diffraction pattern quality variations.

Band contrast (BC) is a qualitative measure of electron back-scattered diffraction (EBSD), which is derived from the intensity of the Kikuchi bands. The BC is dependent upon several factors including scanning electron microscope measurement parameters, EBSD camera setup, and the specimen itself (lattice defect and grain orientation). In this study, the effective factors for BC variations and the feasibility of using BC variations for the quantification of microstructure evolutions have been investigated.

Fabrication of a TEM sample of ion-irradiated material using focused ion beam microprocessing and low-energy Ar ion milling.

Cross-section-view TEM samples of ion-irradiated material are successfully fabricated using a focused ion beam (FIB) system and low-energy Ar ion milling. Ga ion-induced damages in FIB processing are reduced remarkably by the means of low-energy Ar ion milling. There are optimized ion milling conditions for the reduction and removal of the secondary artifacts such as defects and ripples.