Publications by authors named "Hwa-Jin Son"
J Nanosci Nanotechnol
December 2014
Article Synopsis
- The study explored the use of electroless Ni-P films for enhancing 3D interconnect technology by acting as barrier and seed layers in blind-via holes.
- Various treatments and solutions were used to ensure uniform film deposition, including O2 plasma treatment for substrate preparation and palladium chloride activation for the Ni-P films.
- While the Ni-P films effectively prevented copper diffusion up to 300 degrees Celsius, they began to allow copper ions to diffuse at temperatures exceeding 400 degrees Celsius, which could affect performance.
