Bias-Repeatability Analysis of Vacuum-Packaged 3-Axis MEMS Gyroscope Using Oven-Controlled System.

The performance of microelectromechanical system (MEMS) inertial measurement units (IMUs) is susceptible to many environmental factors. Among different factors, temperature is one of the most challenging issues. This report reveals the bias stability analysis of an ovenized MEMS gyroscope.

Design Approach for Reducing Cross-Axis Sensitivity in a Single-Drive Multi-Axis MEMS Gyroscope.

In this paper, a new design technique is presented to estimate and reduce the cross-axis sensitivity (CAS) in a single-drive multi-axis microelectromechanical systems (MEMS) gyroscope. A simplified single-drive multi-axis MEMS gyroscope, based on a mode-split approach, was analyzed for cross-axis sensitivity using COMSOL Multiphysics. A design technique named the "ratio-matching method" of drive displacement amplitudes and sense frequency differences ratios was proposed to reduce the cross-axis sensitivity.

Sensitivity Analysis of Single-Drive, 3-axis MEMS Gyroscope Using COMSOL Multiphysics.

In this paper, a COMSOL Multiphysics-based methodology is presented for evaluation of the microelectromechanical systems (MEMS) gyroscope. The established finite element analysis (FEA) model was successfully validated through a comparison with analytical and Matlab/Simulink analysis results. A simplified single-drive, 3-axis MEMS gyroscope was analyzed using a mode split approach, having a drive resonant frequency of 24,918 Hz, with the x-sense, y-sense, and z-sense being 25,625, 25,886, and 25,806 Hz, respectively.

Single Drive Multi-Axis Gyroscope with High Dynamic Range, High Linearity and Wide Bandwidth.

This paper presents the design, fabrication, and characterization of a highly sensitive, single drive multi-axis gyroscope. The multi-axis gyroscope allows for a wide bandwidth in all three axes (X, Y, Z) and exhibits high linearity. The fabricated multi-axis gyroscope was fabricated with a structural thickness of 30 µm and packaged at 100 mtorr using wafer level packaging.