Integrated hybrid silicon triplexer.

We demonstrate an integrated triplexer on silicon with a compact size of 1mm by 3.5mm by utilizing a selective area wafer bonding technique. The wavelength demultiplexer on the triplexer chip successfully separates signals at wavelengths of 1310 nm, 1490 nm and 1550 nm with more than 10 dB extinction ratio.

Electrically-pumped compact hybrid silicon microring lasers for optical interconnects.

We demonstrate an electrically-pumped hybrid silicon microring laser fabricated by a self-aligned process. The compact structure (D = 50 microm) and small electrical and optical losses result in lasing threshold as low as 5.4 mA and up to 65 degrees C operation temperature in continuous-wave (cw) mode.

1310nm silicon evanescent laser.

We report the first 1310 nm hybrid laser on a silicon substrate. This laser operates continuous wave (C.W.