Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method.

In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of chip packaging. Surface morphological defects are one of the main factors affecting the reliability of micro bumps, which are closely related to materials and bonding process parameters.

Wideband and Large Angle Electromagnetically Induced Transparency by the Equivalent Transmission Line in a Metasurface.

A classical structure for a U-shaped metasurface exhibiting a wideband and large angle electromagnetically induced transparency (EIT) effect in the terahertz range is proposed. One horizontal and two vertical strips, which represent the bright and dark modes, respectively, are created for the U-shaped structure. The finite integration time domain (FITD) and equivalent circuit method are compared with the EIT result.