Ultralow-Power Programmable 3D Vertical Phase-Change Memory with Heater-All-Around Configuration.

Recent advancements in phase-change memory (PCM) technology have predominantly stemmed from material-level designs, which have led to fast and durable device performances. However, there remains a pressing need to address the enormous energy consumption through device-level electrothermal solutions. Thus, the concept of a 3D heater-all-around (HAA) PCM fabricated along the vertical nanoscale hole of dielectric/metal/dielectric stacks is proposed.

Spontaneous sparse learning for PCM-based memristor neural networks.

Neural networks trained by backpropagation have achieved tremendous successes on numerous intelligent tasks. However, naïve gradient-based training and updating methods on memristors impede applications due to intrinsic material properties. Here, we built a 39 nm 1 Gb phase change memory (PCM) memristor array and quantified the unique resistance drift effect.

Evolution of crystal structures in GeTe during phase transition.

We investigated changes in the crystal structure of GeTe during its phase transition. Using density functional theory (DFT) calculations, four possible crystal structures were identified: R3m, P1, Cm, and Fm3m. Among these, P1 and Cm were examined here for the first time.

Thermal and Electrical Conduction of Single-crystal Bi2Te3 Nanostructures grown using a one step process.

Single-crystal Bi2Te3 nanowires (NWs) and nanoribbons (NRs) were synthesized by a vapor-liquid-solid (VLS) method from Bi2Te3 powder. To investigate the thermal properties of the Bi2Te3 nanostructure, a nondestructive technique based on temperature dependent Raman mapping was carried out. The Raman peaks were red shifted with increasing temperature.

Evolution of the surface state in Bi2Se2Te thin films during phase transition.

Topological insulators, a new quantum state of matter, have created exciting opportunities for studies in topological quantum physics and for exploring spintronics applications due to their gapless helical metallic surface states. In this study, thin films composed of alternate layers of Bi and Se (Te) ({Bi(3 Å)Te(9 Å)}n/{Bi(3 Å)Se(9 Å)}n) were fabricated by controlling the layer thickness within the atomic scale using thermal evaporation techniques. The high-purity growth of uniform Bi2Se2Te1 thin films has not yet been achieved using a thermal evaporation method.

Dimensional effect of non-polar resistive random access memory (RRAM) for low-power memory application.

The relationships between the resistive cell dimension and the related analytical parameters such as the forming voltage, set voltage, and reset current were investigated to implement high-density and low-power unipolar RRAM. It was shown that the formation process in unipolar switching is strongly related to the cell dimension in the sub-nm region, not only in terms of its vertical thickness but also of its horizontal length, using the numerical simulation method. With the optimal cell size having sufficient initial resistance and a low forming voltage, the achievement of the greatest feasibility of the high-density low-power RRAM will be further accelerated.

Interface-modified unipolar resistive random access memory (RRAM) structure for low-power application.

An interface-engineered resistive random access memory (RRAM) using bilayer transition metal oxide (TMO) is presented for improving unipolar resistive-switching characteristics. The experiment and simulation data show that better resistive switching characteristics and superb uniformity can be realized by inserting a thin AIOx insertion layer between the Ir/NiO interface. To elucidate the uniformity improvement of our bilayer structure, the conducting-defect effects in the resistive cell were also investigated using a random circuit breaker (RCB) simulation model.

Electronic structure of Te/Sb/Ge and Sb/Te/Ge multi layer films using photoelectron spectroscopy.

Te/Sb/Ge and Sb/Te/Ge multilayer films with an atomically controlled interface were synthesized using effusion cell and e-beam techniques. The layers interacted during the deposition, resulting in films composed of Sb-Te+Sb-Sb/Ge and Sb/Sb-Te/Ge-Te/Ge respectively. Atomic diffusion and chemical reactions in films during the annealing process were investigated by photoemission spectroscopy.