Publications by authors named "Hongjun Ji"

Model Order Reduction (MOR) techniques have extensive applications across scientific and engineering disciplines, such as neutron field reconstruction of nuclear reactor cores, thermoelastic field reconstruction, fluid, and solid mechanics. In the process of building a Reduced Order Model (ROM), the selection of the basis functions in the offline stage is crucial and directly depends on the parameter space sampling strategy. This problem has always been a challenge in MOR.

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Structural color, renowned for its enduring vibrancy, has been extensively developed and applied in the fields of display and anticounterfeiting. However, its limitations in brightness and saturation hinder further application in these areas. Herein, we propose a pendant evaporation self-assembly method to address these challenges simultaneously.

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Robust anti-counterfeiting techniques aim for easy identification while remaining difficult to forge, especially for high-value items such as currency and passports. However, many existing anti-counterfeiting techniques rely on deterministic processes, resulting in loopholes for duplication and counterfeiting. Therefore, achieving high-level encryption and easy authentication through conventional anti-counterfeiting techniques has remained a significant challenge.

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The current methods of constructing modification strategies for hydrophilic membranes are time-consuming, complex in operation, and poor in universality, which limit their application on membranes. In this work, inspired by the adhesion properties and versatility of caffeic acid (CA) and -phenylenediamine (PPDA), a simple, rapid, and universal method was designed for the separation of oil-in-water emulsion by preparing a stable hydrophilic coating separation membrane. The preparation time of the membrane was shortened to 40 min.

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Multicomponent/heterostructured liquid crystalline elastomers (LCEs) have recently garnered extensive attention for the design of soft robots with high dexterity and flexibility. However, the reported integration strategies of LCEs seriously suffer from high welding temperature, long processing time, and poor joint quality. Herein, the high-efficiency seamless ultrasonic welding (UW) of reprogrammable silver nanowire-LCE composites (AgNW-LCEs) have been realized without any auxiliary reagents based on the dynamic silver-disulfide coordination interactions.

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Metal-based materials possess superior electromagnetic interference (EMI) shielding performance because of their extraordinary electrical conductivity. Nevertheless, the high density and structural rigidity of metals seriously limit their applicability in portable and wearable electronic equipment. A common method for reducing the density of metal-based materials is to prepare metal nanowire aerogels by freeze-drying, but the weak connection among the nanowires results in poor mechanical and electrical properties.

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Flexible electronics can be seamlessly attached to human skin and used for various purposes, such as pulse monitoring, pressure measurement, tensile sensing, and motion detection. Despite their broad applications, most flexible electronics do not possess both high sensitivity and wide detection range simultaneously; their sensitivity drops rapidly when they are subjected to even just medium pressure. In this study, ultrabroad-range, high-sensitivity flexible electronics are fabricated through additive manufacturing to address this issue.

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Graphene has been considered as an excellent biochemical sensors' substrate material because of its excellent physical and chemical properties. Most of these sensors have employed enzymes, antibodies, antigens, and other biomolecules with corresponding recognition ability as recognition elements, to convert chemical signals into electrical signals. However, oxidoreductase enzymes that grow on graphene surfaces are affected significantly by the environment and are easily inactivated, which hinders the further improvement of detection sensitivity and robusticity.

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Conjugated fluorescent materials are getting more and more attention in the biomedical arena due to their high fluorescence intensity, non-bleaching and good biocompatibility. However, conjugated fluorescent materials are still not widely used in the field of anti-counterfeiting and pattern encryption due to their extremely low solubility and enormous difficulties in processing. Here, we use a facile approach to fabricate conjugated polymer fluorescent nanoparticles through a classic micro-emulsion method to address these issues.

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The accelerated urbanization in China has caused intensified micro-pollution problems for drinking water sources, severely challenging drinking water treatment efficiencies and its biostability. This study mainly investigated the effects of ozonation on disinfection by-product formation potentials (DBPFPs) and biological dissolved organic carbon (BDOC) in a pilot-scale ozonation-biological activated carbon advanced drinking water treatment plant with micro-polluted raw water. The results indicated that the micro-polluted water would be effectively treated in the advanced treatment processes with DBPFPs significantly eliminated.

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A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) for signal conditioning/readout and wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing on a carrier substrate before attaching to the body. Here, we report a universal fabrication scheme to enable printing and room-temperature sintering of the metal nanoparticle on paper/fabric for FPCBs and directly on the human skin for on-body sensors with a novel sintering aid layer.

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The high-melting-point joints by transient-liquid-phase are increasingly playing a crucial role in the die bonding for the high temperature electronic components. In this study, three kinds of Sn/Ni composite solder pastes composed of different sizes of Ni particles were synthesized to accelerate metallurgical reaction among Sn/Ni interfaces under the ultrasonic-assisted transient liquid phase (U-TLP) soldering. The temperature evolution, microstructure and mechanical property in joints composed by these composite solder pastes with or without ultrasonic energy were systemically investigated.

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The development of classical and quantum information-processing technology calls for on-chip integrated sources of structured light. Although integrated vortex microlasers have been previously demonstrated, they remain static and possess relatively high lasing thresholds, making them unsuitable for high-speed optical communication and computing. We introduce perovskite-based vortex microlasers and demonstrate their application to ultrafast all-optical switching at room temperature.

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Electromagnetic interference protection in optoelectronic devices is challenging because of the dual requirements of optical transmittance and high shielding effectiveness (SE). Herein, we propose a novel silver nanowire (AgNW)/polyethylene terephthalate (PET) multi-layer mesh pattern structure for transparent electromagnetic shielding obtained via laser marking and transfer printing. A three-layer composite shielding film with an optical transmittance of 67.

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The popularity of 2D barcodes is playing a key role in simplifying people's daily life activities, such as identification, quick payment, checking in and checking out, However, relevant issues have emerged as their popularity has soared. The most urgent and representative problem is decryption, which may lead to serious information leakage and substantial damage to organizations, such as governments and international enterprises. This issue is mainly due to the visibility of 2D barcodes.

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Sintering of metallic nanoparticles (NPs) at low temperature is highly wanted in the manufacturing of flexible electronics. And for ink-jet printing, the metallic NPs after printing usually need thermal or chemical post-treatment to remove stabilizing agents and achieve conductivity. Here, we reported a facile method to realize one-step printed sintering of silver nanoparticle (AgNP) ink at room temperature by using intermediate coated layers composed of oxide NPs and polyvinyl alcohol (PVA) mixture.

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The development of flexible current collectors as an indispensable component in energy storage devices has been in strong demand for the ever-growing market of flexible and wearable electronics. Herein, flexible and conductive paper-based current collectors are fabricated by directly depositing a metallic Ni layer composed of spiny Ni nanospheres of 400 nm diameter on the surface of filter paper via electroless deposition. The metallic paper shows excellent electric and mechanical properties: the sheet resistance is 2.

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Microfluidics has made a very impressive progress in the past decades due to its unique and instinctive advantages. Droplet-based microfluidic systems show excellent compatibility with many chemical and biological reagents and are capable of performing variety of operations that can implement microreactor, complex multiple core-shell structure, and many applications in biomedical research such as drug encapsulation, targeted drug delivery systems, and multifunctionalization on carriers. Droplet-based systems have been directly used to synthesize particles and encapsulate many biological entities for biomedicine applications due to their powerful encapsulation capability and facile versatility.

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Sensitivity and transparency are critical properties for flexible and wearable electronic devices, and how to engineer both these properties simultaneously is dramatically essential. Here, for the first time, we report the assembly of ordered array structures of silver nanowires (AgNWs) via a simple water-bath pulling method to align the AgNWs embedded on polydimethylsiloxane (PDMS). Compared with sensors prepared by direct drop-casting or transfer-printing methods, our developed sensor represents a considerable breakthrough in both sensitivity and transparency.

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Patterned circuits on highly stretchable conductive films are critical in the practical application of next-generation flexible and wearable devices. Currently, most patterned circuits do not exhibit highly stretchable properties, and a lithography process in vacuum is required. In this study, silver nanoparticles (AgNPs) and liquid polydimethylsiloxane (PDMS) are mixed together to form liquid conductive adhesives (CAs).

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For binary element atomization, it is essential to investigate the phase transformation from liquid to solid as a functions of the droplet sizes, as well as the reaction competitiveness, during gas atomizing solidification of their nuclei. In the present work, a series of phase transformations of undercooled Cu (60.9 wt.

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As a promising replacement material for indium tin oxide in flexible electronics, silver nanowires (AgNWs) usually need complicated post-treatment to reduce the high contact resistance across the intersections when used as transparent conductive films. In this work, a widely applicable nano-joining method for improving the overall conductivity of AgNW networks with different kinds of electrolyte solutions is presented. By treatment with an electrolyte solution with appropriate ionic strengths, the insulating surfactant layer (polyvinylpyrrolidone, PVP) on the AgNWs could be desorbed, and the AgNW network could be densified.

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Sintering of low-cost Cu nanoparticles (NPs) for interconnection of chips to substrate at low temperature and in atmosphere conditions is difficult because they are prone to oxidation, but dramatically required in semiconductor industry. In the present work, we successfully synthesized Cu@Ag NPs paste, and they were successfully applied for joining Cu/Cu@Ag NPs paste/Cu firstly in air by the ultrasonic-assisted sintering (UAS) at a temperature of as low as 160 °C. Their sintered microstructures featuring with dense and crystallized cells are completely different from the traditional thermo-compression sintering (TCS).

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Highly conductive Cu-Cu interconnections of SiC die with Ti/Ni/Cu metallization and direct bonded copper substrate for high-power semiconductor devices are achieved by the low-temperature sintering of Cu nanoparticles with a formic acid treatment. The Cu-Cu joints formed via a long-range sintering process exhibited good electrical conductivity and high strength. When sintered at 260 °C, the Cu nanoparticle layer exhibited a low resistivity of 5.

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Fluxless brazing of bare alumina with Cu was conducted with an ultrasonic-assisted brazing technique by a Zn-14wt.%Al filler. The shear strength of Cu/alumina joints (84MPa) exhibited 27% larger than the alumina/Cu joints (66MPa) due to different intermetallic phases and their morphologies formed in the seam under the same parameters, which are probably attributed to the transmission rate of ultrasonic energy varying with density of the ultrasonic horn-contacted materials.

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