Enhanced Fracture Resistance of Flexible ZnO:Al Thin Films in Situ Sputtered on Bent Polymer Substrates.

Improving the fracture resistance of inorganic thin films is one of the key challenges in flexible electronic devices. A nonconventional in situ sputtering method is introduced to induce residual compressive stress in ZnO:Al thin films during deposition on a bent polymer substrate. The films grown under a larger prebending strain resulted in a higher fracture resistance to applied strains by exhibiting a ∼ 70% improvement in crack-initiating critical strain compared with the reference sample grown without bending.

Prestress Driven Improvement in Fracture Behavior of in Situ Sputtered Zinc Oxide Thin Films on Stretched Polymer Substrates.

Flexible electronic devices need to survive bending or stretching operation without mechanical failure. If inorganic thin films are involved in the device structure, the evolution of cracks is a major challenge to overcome. Here, we report a novel way to substantially improve the fracture behavior of films that are based on intentional utilization of residual stress on the films by in situ sputtering on a stretched polymer substrate.

AlN passivation layer-mediated improvement in tensile failure of flexible ZnO:Al thin films.

AlN passivation layer-mediated improvement in tensile failure of ZnO:Al thin films on polyethersulfone substrates is investigated. ZnO:Al films without any passivation layer were brittle with a crack-initiating bending strain εc of only about 1.13% with a saturated crack density ρs of 0.