Publications by authors named "Hodaka Otsuka"

Microelectromechanical systems (MEMS)-based capacitive pressure sensors are conventionally fabricated from diaphragms made of Si, which has a high elastic modulus that limits the control of internal stress and constrains size reduction and low-pressure measurements. Ru-based thin-film metallic glass (TFMG) exhibits a low elastic modulus, and the internal stress can be controlled by heat treatment, so it may be a suitable diaphragm material for facilitating size reduction of the sensor without performance degradation. In this study, a Ru-based TFMG was used to realize a flattened diaphragm, and structural relaxation was achieved through annealing at 310 °C for 1 h in a vacuum.

View Article and Find Full Text PDF