Reliability Investigation of Silicide-Based Thermoelectric Modules.

The reliability and failure mechanisms of silicide-based thermoelectric modules (-type Mg(Si,Sn)/-type HMS) were investigated thanks to two types of thermal tests with either a fixed or a cycling thermal gradient, under different atmospheres. The hot interfaces of the thermoelectric modules were analyzed by scanning electron microscopy and X-ray diffraction after the reliability tests. The current thermoelectric modules do not exhibit any failure mechanism under ambient air for a hot side temperature of 250 °C for tests conducted either during 500 h at a fixed temperature gradient or after 1000 thermal cycles.

Thermal Stability of MgSiSn under Oxidation Conditions.

The use of MgSiSn under air in thermoelectric modules in the mid-temperature range of 400-600 °C is linked to its ability to resist oxidation. In this study, oxidation experiments performed at 400 °C under air evidenced the stability of the material, either under static conditions (up to 100 h) or under severe heating-cooling cyclic conditions (up to 400 cycles), showing its ability to be used in a reliable way at this temperature. By combining thermogravimetry, scanning electron microscopy, temperature X-ray diffraction analysis, and mechanical and thermodynamic considerations, a mechanism is proposed explaining how MgSiSn further undergoes decomposition with time under air when treated above 500 °C.