Evolution of the Laser-Induced Spallation Technique in Film Adhesion Measurement.

Laser-induced spallation is a process in which a stress wave generated from a rapid, high-energy laser pulse initiates the ejection of surface material opposite the surface of laser impingement. Through knowledge of the stress-wave amplitude that causes film separation, the adhesion and interfacial properties of a film-on-substrate system are determined. Some advantages of the laser spallation technique are the noncontact loading, development of large stresses (on the order of GPa), and high strain rates, up to 10/s.