Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration.

This paper examined the reliability of complex PCB assemblies under random vibration and temperature cycling, which are two primary causes of assembly failure. A combination of finite element simulation and environmental testing was employed to investigate the effects of different reinforcement methods and solder joint morphology on assembly reliability. The linear accumulation of damage was utilized to predict assembly failure, and the predicted failure damage was compared with the damage extracted post-testing to validate the simulation analysis.

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review.

With the advancement of Moore's Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device's failure.

Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method.

In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of chip packaging. Surface morphological defects are one of the main factors affecting the reliability of micro bumps, which are closely related to materials and bonding process parameters.

Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study.

To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for high-density interconnects, the most persistent factor affecting their reliability is the electromigration (EM) problem on the micro-bump. The operating temperature and the operating current density are the main factors affecting the EM phenomenon.

Internal Social Attention: Gaze Cues Stored in Working Memory Trigger Involuntary Attentional Orienting.

Previous research has shown that social cues, including eye gaze, can readily guide our focus of attention-a phenomenon referred to as . Here, we demonstrated that internally maintained social cues in working memory (WM) can produce an analogous attentional effect ( = 57). Using the delayed-match-to-sample paradigm combined with the dot-probe task, we found that holding irrelevant gaze cues in WM can induce attentional orienting in college-age adults.

Happy is stronger than sad: Emotional information modulates social attention.

Social directional cues (e.g., gaze direction; walking direction) can trigger reflexive attentional orienting, a phenomenon known as social attention.

Cross-modal social attention triggered by biological motion cues.

Previous research has demonstrated that biological motion (BM) cues can induce reflexive attentional orienting. This BM-triggered social attention has hitherto only been investigated within visual modality. It remains unknown whether and to what extent social attention induced by BM cues can occur across different sensory modalities.

Cross-category adaptation of reflexive social attention.

Social attention is crucial for efficient social interactions and adaptive functioning in humans. However, whether this indispensable ability is unique and qualitatively distinct from nonsocial attention remains equivocal. Using the visual adaptation technique in conjunction with a modified central cueing paradigm, the current study investigated the specificity of social attention.

Heritability of reflexive social attention triggered by eye gaze and walking direction: common and unique genetic underpinnings.

Background: Social attention ability is crucial for human adaptive social behaviors and interpersonal communications, and the malfunction of which has been implicated in autism spectrum disorder (ASD), a highly genetic neurodevelopmental disorder marked by striking social deficits.

Methods: Using a classical twin design, the current study investigated the genetic contribution to individual variation in social and non-social attention abilities, and further probed their potential genetic linkage. Moreover, individual autistic traits were further measured in an independent group of non-twin participants to examine the hypothetical link between the core social attention ability and ASD.

A Review of Graphene on NEMS.

Background: Graphene is a new type of two-dimensional crystal material, and its single atomic layer structure shows many excellent physical and chemical properties such as large specific surface area, good electrical conductivity and high Young's modulus. However, few relevant patents to the topic have been reviewed and cited. This paper mainly deals with the methods of the preparations of graphene and graphene applications in NEMS sensors, NEMS devices, optics, energy storage, and biomedical fields.