Materials (Basel)
February 2023
Cu-2.4 wt.%V nanocomposite has been prepared by mechanical alloy and vacuum hot-pressed sintering technology.
View Article and Find Full Text PDFCopper⁻graphite composites reinforced with SiO₂ particles were fabricated by powder metallurgy technique. Electroless copper plating was introduced to improve the interfacial bonding between SiO₂ particles and copper matrix. The microstructure, density, and hardness of the composites were characterized.
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