Although adhesion failure in hair fibers can occur inside cells, it occurs more frequently in the cell membrane complex (CMC), often involving the rupture of interlayer bonds. Therefore, a model of the CMC is presented, based on prior research in which we propose interconnecting bonds between the layers to assist in our interpretation of hair-fracturing mechanisms for cuticle chipping, deep transverse cuticle cracks, cracks during heat drying, scale lifting by surfactants, and catastrophic failure. Failure in the wet state generally involves hydrophilic layers, e.
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