Corrosion Protection of Copper Using AlO, TiO, ZnO, HfO, and ZrO Atomic Layer Deposition.

Atomic layer deposition (ALD) is a viable means to add corrosion protection to copper metal. Ultrathin films of AlO, TiO, ZnO, HfO, and ZrO were deposited on copper metal using ALD, and their corrosion protection properties were measured using electrochemical impedance spectroscopy (EIS) and linear sweep voltammetry (LSV). Analysis of ∼50 nm thick films of each metal oxide demonstrated low electrochemical porosity and provided enhanced corrosion protection from aqueous NaCl solution.