Control of Size Uniformity of Cu Nanoparticle Array Produced by Plasma-Induced Dewetting.

The effects of plasma parameters such as plasma density, electron temperature, and sheath voltage on the uniformity of Cu nanoparticle arrays were investigated. These parameters were controlled by varying the pressure, RF power, and substrate bias voltage. A floating harmonic method was used to monitor the plasma parameters.

Mechanism of solid-state plasma-induced dewetting for formation of copper and gold nanoparticles.

Cu and Au nanoparticles were fabricated by plasma treatment on Cu and Au films at 653 K. The nanoparticles were formed by dewetting the metallic films using plasma. Scanning electron microscopy and transmission electron microscopy investigations showed that the plasma-induced dewetting of the Cu and Au films proceeded through heterogeneous hole nucleation and growth along the grain boundaries to lower the surface energy.

Synthesis of copper nanoparticles by solid-state plasma-induced dewetting.

Copper nanoparticles were prepared by the plasma treatment of Cu thin films without extra heating. The Cu nanoparticles were formed through a solid-state dewetting process at temperatures of less than 450 K. The particle sizes, from 10 to 80 nm, were controlled by changing the thickness of the Cu film; the particle size increased linearly with the film thickness.