Publications by authors named "Hagen Klippel"

Finishing machining of Ti6Al4V, known for its high strength and heat conduction resistance, demands optimisation to achieve high-quality end products. This study explores modifying the chip contact length on the rake face and altering the flank face with a cavity to minimise process forces and temperatures while maintaining cutting edge integrity. The research validates the manufacturability of ultra-short pulsed laser-ablated tool geometry modifications, indicating potential for industrial scale-up.

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Unlabelled: The numerical simulation of metal cutting processes requires material data for constitutive equations, which cannot be obtained with standard material testing procedures. Instead, inverse identifications of material parameters within numerical simulation models of the cutting experiment itself are necessary. This report presents the findings from a large-scale study of dry orthogonal cutting experiments on Ti6Al4V (Grade 5) and Ck45 (AISI 1045).

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Diamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing.

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