Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics.

As the need for high-speed electronics continues to rise rapidly, printed wiring board (PWB) requirements become ever-more demanding. A typical PWB is fabricated by bonding dielectric films such as polyimide to electrically conductive copper foil such as rolled annealed (RA) copper and is expected to become thinner, flexible, durable, and compatible with high-frequency 5G performance. Polyimide films inherently feature a higher coefficient of thermal expansion (CTE) than copper foils; this mismatch causes residual thermal stresses.

High-performance, stable organic thin-film field-effect transistors based on bis-5'-alkylthiophen-2'-yl-2,6-anthracene semiconductors.

The development of new organic semiconductors with improved electrical performance and enhanced environmental stability is the focus of considerable research activity. This communication presents the design, synthesis, and device stability data for novel bis-5'-alkylthiophen-2'yl-2,6-anthracene organic semiconductors. When incorporated into thin-film field-effect transistors, mobilities as high as 0.

Effect of stamp deformation on the quality of microcontact printing: theory and experiment.

Microcontact printing (microCP) is an effective way to generate micrometer- or submicrometer-sized patterns on a variety of substrates. However, the fidelity of the final pattern depends critically on the coupled phenomena of stamp deformation, fluid transfer between surfaces, and the ability of the ink to self-assemble on the substrate. In particular, stamp deformation can produce undesirable effects that limit the practice and precision of microCP.