A tale of two transfers: characterizing polydimethylsiloxane viscoelastic stamping and heated poly bis-A carbonate transfer of hexagonal boron nitride.

Two-dimensional (2D) materials have many applications ranging from heterostructure electronics to nanofluidics and quantum technology. In order to effectively utilize 2D materials towards these ends, they must be transferred and integrated into complex device geometries. In this report, we investigate two conventional methods for the transfer of 2D materials: viscoelastic stamping with polydimethylsiloxane (PDMS) and a heated transfer with poly bis-A carbonate (PC).