Innovative Integration of Dual Quantum Cascade Lasers on Silicon Photonics Platform.

For the first time, we demonstrate the hybrid integration of dual distributed feedback (DFB) quantum cascade lasers (QCLs) on a silicon photonics platform using an innovative 3D self-aligned flip-chip assembly process. The QCL waveguide geometry was predesigned with alignment fiducials, enabling a sub-micron accuracy during assembly. Laser oscillation was observed at the designed wavelength of 7.

Wavelength tuning of VCSELs via controlled strain.

Besides major advantages for telecommunication applications, vertical-cavity surface-emitting lasers (VCSELs) have attracted interest for their potential for neuro-inspired computing, frequency comb generation, or high-frequency spin oscillations. In the meantime, strain applied to the laser structure has been shown to have a significant impact on the laser emission properties such as the polarization dynamics or birefringence. In this work, we further explore the influence of strain on VCSELs and how this effect could be used to fine-tune the laser wavelength.

Photonic Integrated Circuit Based Temperature Sensor forOut-of-Autoclave Composite Parts Production Monitoring.

The use of composite materials has seen widespread adoption in modern aerospace industry. This has been facilitated due to their favourable mechanical characteristics, namely, low weight and high stiffness and strength. For broader implementation of those materials though, the out-of-autoclave production processes have to be optimized, to allow for higher reliability of the parts produced as well as cost reduction and improved production speed.

Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling.

To increase the manufacturing throughput and lower the cost of silicon photonics packaging, an alignment tolerant approach is required to simplify the process of fiber-to-chip coupling. Here, we demonstrate an alignment-tolerant expanded beam backside coupling interface (in the O-band) for silicon photonics by monolithically integrating microlenses on the backside of the chip. After expanding the diffracted optical beam from a TE-mode grating through the bulk silicon substrate, the beam is collimated with the aid of microlenses resulting in an increased coupling tolerance to lateral and longitudinal misalignment.

Imprinted Polymer-Based Guided Mode Resonance Grating Strain Sensors.

Optical sensors based on guided mode resonance (GMR) realized in polymers are promising candidates for sensitive and cost effective strain sensors. The benefit of GMR grating sensors is the non-contact, easy optical read-out with large working distance, avoiding costly alignment and packaging procedures. The GMR gratings with resonance around 850-900 nm are fabricated using electron beam lithography and replicated using a soft stamp based imprinting technique on 175 μ m-thick foils to make them suitable for optical strain sensing.