The effects of cavity disinfection on the nanoleakage of compomer restorations: an in vitro study.

Purpose: Cavity disinfection, in addition to routine caries removal methods, is recommended to eliminate the microorganisms. The aim of this study was to compare the effect of various systems Er,Cr:YSGG lasers, diode lasers and FotoSan and agents Corsodyl; Cervitec and Cervitec Plus and Fluor Protector-on the nanoleakage of compomer restorations when used for cavity disinfection.

Materials And Methods: A total of 40 intact human deciduous molar teeth containing Black V cavities (3×2×1.

Repair of aged bulk-fill composite with posterior composite: Effect of different surface treatments.

Objective: In the present study, the ability of posterior resin composite to repair aged bulk-fill resin composite and vice versa were assessed by shear bond strength testing.

Materials And Methods: Resin composite substrates were aged and surfaces were abraded with abrasive papers, then bulk-fill substrates were repaired with posterior resin composite and vice versa using different surface treatments (no surface treatment [control]; etching with 37% phosphoric acid [H PO ] for 20 seconds; etching with 10% hydrofluoric acid [HF] for 20 seconds; etching with 37% H PO for 20 seconds + adhesive application; etching with 10% HF for 20 seconds + adhesive application; adhesive application only). Shear bond strengths (SBS) were then measured and surface roughness values (Ra) were determined.

Bonding performance of universal adhesives to er,cr:YSGG laser-irradiated enamel.

Universal adhesives have been recently introduced for use as self-etch or etch-and-rinse adhesives depending on the dental substrate and clinical condition. However, their bonding effectiveness to laser-irradiated enamel is still not well-known. Thus, the aim of this study was to compare the shear bond strength (SBS) of universal adhesives (Single Bond Universal; Nova Compo-B Plus) applied to Er,Cr:YSGG laser-irradiated enamel with SBS of the same adhesives applied in self-etch and acid-etching modes, respectively.