Publications by authors named "Eungchul Kim"

The commercialization of 3D heterogeneous integration through hybrid bonding has accelerated, and accordingly, Cu-polymer bonding has gained significant attention as a means of overcoming the limitations of conventional Cu-SiO hybrid bonding, offering high compatibility with other fabrication processes. Polymers offer robust bonding strength and a low dielectric constant, enabling high-speed signal transmission with high reliability, but suffer from low thermomechanical stability. Thermomechanical stability of polymers was not achieved previously because of thermal degradation and unstable anchoring.

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Article Synopsis
  • Two-dimensional ferroelectric materials, like CuInPS, are promising for advanced 3D electronic devices, particularly in neuromorphic computing, due to their unique properties.
  • CuInPS behaves as a ferroelectric insulator at room temperature and requires external conditions to activate its ionic conduction, which can lead to randomness in performance.
  • Researchers developed a method to mechanically manipulate free-standing 2D ferroelectric structures to enhance controlled ion transport, resulting in a significant increase in current and potential applications in efficient self-powered systems and reliable neuromorphic devices.
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Molecular electronics enables functional electronic behavior via single molecules or molecular self-assembled monolayers, providing versatile opportunities for hybrid molecular-scale electronic devices. Although various molecular junction structures are constructed to investigate charge transfer dynamics, significant challenges remain in terms of interfacial charging effects and far-field background signals, which dominantly block the optoelectrical observation of interfacial charge transfer dynamics. Here, tip-induced optoelectrical engineering is presented that synergistically correlates photo-induced force microscopy and Kelvin probe force microscopy to remotely control and probe the interfacial charge transfer dynamics with sub-10 nm spatial resolution.

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Among the transition metal dichalcogenides (TMD), tungsten disulfide (WS) and molybdenum disulfide (MoS) are promising sulfides for replacing noble metals in the hydrogen evolution reaction (HER) owing to their abundance and good catalytic activity. However, the catalytic activity is derived from the edge sites of WS and MoS, while their basal planes are inert. We propose a novel process for N-doped TMD synthesis for advanced HER using N + Ar + HS plasma.

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The effects of photo-oxidative degradation of polyacids at various concentrations and with different durations of ultraviolet (UV) irradiation on the photo-reduction of ceria nanoparticles were investigated. The effect of UV-treated ceria on the performance of chemical mechanical polishing (CMP) for the dielectric layer was also evaluated. When the polyacids were exposed to UV light, they underwent photo-oxidation with consumption of the dissolved oxygen in slurry.

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Metal oxide semiconductors are of great interest for enabling advanced photodetectors. However, operational instability and the absence of an appropriate doping technique hinder practical development and commercialization. Here, a strategy is proposed to dramatically increase the conventional photodetection performance, having superior stability in operational and environmental atmospheres.

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Nanostructural modification of two-dimensional (2D) materials has attracted significant attention for enhancing hydrogen evolution reaction (HER) activity. In this study, the nanostructure of TaSfilms was controlled by controlling the Ar/HS gas ratio used in plasma-enhanced chemical vapor deposition (PECVD). At a high Ar/HS gas ratio, vertically aligned TaS(V-TaS) films were formed over a large-area (4 in) at a temperature of 250 °C, which, to the best of our knowledge, is the lowest temperature reported for PECVD.

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The trade-off between thermal conductivity (κ) and thermal contact resistance (R ) is regarded as a hurdle to develop superior interface materials for thermal management. Here a high-temperature skin softening material to overcome the trade-off relationship, realizing a record-high total thermal conductance (254.92 mW mm K ) for isotropic pad-type interface materials is introduced.

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Candida albicans is an opportunistic fungal pathogen whose responses to environmental changes are associated with the virulence attributes. Edc3 is known to be an enhancer of the mRNA decapping reactions and a scaffold protein of cytoplasmic processing bodies (P-bodies). Recent studies of C.

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