Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems.

To accommodate the ever-growing data requirements in densely populated areas and address the need for high-resolution sensing in diverse next-generation applications, there is a noticeable trend towards utilizing large unallocated frequency bands above 100 GHz. To overcome the harsh propagation conditions, large-scale antenna arrays are crucial and urge the need for cost-effective, mass-manufacturable technologies. A dedicated Any-Layer High Density Interconnect PCB technology for highly efficient wireless D-band (110-170 GHz) systems is proposed.