Specific ion effects on copper electroplating.

The main goal of this work is to open new perspectives in the field of electrodeposition and provide green alternatives to the electroplating industry. The effect of different anions (SO, ClO, NO, ClO, BF, PF) in solution on the electrodeposition of copper was investigated. The solutions, containing only the copper precursor and the background electrolyte, were tailored to minimize the environmental impact and reduce the use of organic additives and surfactants.