Publications by authors named "E POP"
The electrical resistivity of conventional metals such as copper is known to increase in thin films as a result of electron-surface scattering, thus limiting the performance of metals in nanoscale electronics. Here, we find an unusual reduction of resistivity with decreasing film thickness in niobium phosphide (NbP) semimetal deposited at relatively low temperatures of 400°C. In films thinner than 5 nanometers, the room temperature resistivity (~34 microhm centimeters for 1.
View Article and Find Full Text PDFDigital Twins, represents an innovative approach consisting of real-time digital replicas of physical entities. This innovative concept has already many applications in Industry, automotive, business environment and is also transforming the healthcare industry. Digital Twins have the potential to provide comprehensive models of individual patients, hospital facilities, and medical processes, integrating data from various sources such as electronic health records, wearable devices, and imaging systems.
View Article and Find Full Text PDFMagnetic tunnel junctions (MTJs) with ultrathin MgO tunnel barriers are at the heart of magnetic random-access memory (MRAM) and exhibit potential for spin caloritronics applications due to the tunnel magneto-Seebeck effect. However, the high programming current in MRAM can cause substantial heating which degrades the endurance and reliability of MTJs. Here, we report the thermal characterization of ultrathin CoFeB/MgO multilayers with total thicknesses of 4.
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- Two-dimensional (2D) electronics like WS semiconductors need low contact resistance for optimal performance, but the interaction with Ni contacts isn't fully understood due to their misalignment.* -
- Research shows that the size of Ni contacts affects the strain on WS devices, with longer contacts (1 μm) causing a significant reduction in performance compared to shorter ones (0.1 μm), leading to differing resistances.* -
- Thermal annealing can help relieve strain in long-contact devices, enhancing performance, indicating that mechanical and thermal factors are key to improving 2D semiconductor devices.*
Any electrical signal propagating in a metallic conductor loses amplitude due to the natural resistance of the metal. Compensating for such losses presently requires repeatedly breaking the conductor and interposing amplifiers that consume and regenerate the signal. This century-old primitive severely constrains the design and performance of modern interconnect-dense chips.
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