Nanometer-thick copper films with low resistivity grown on 2D material surfaces.

Thin Copper (Cu) films (15 nm) are deposited on different 2D material surfaces through e-beam deposition. With the assist of van der Waals epitaxy growth mode on 2D material surfaces, preferential planar growth is observed for Cu films on both MoS and WSe surfaces at room temperature, which will induce a polycrystalline and continuous Cu film formation. Relative low resistivity values 6.