Publications by authors named "Dongfang Pan"

A transformer-in-package (TiP) isolated direct current-direct current (DC-DC) converter using glass-based fan-out wafer-level packaging (FOWLP) is proposed. By using 3-layer redistribution layers (RDLs), both the transformer and interconnections are built without an additional transformer chip, and the converter only has 2 dies: a transmitter (TX) chip and a receiver (RX) chip. The proposed solution results in a significant reduction in the cost and makes major improvements in the form factor and power density.

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Aim: This study aims to examine financial literacy's impact on individual investors' financial behaviour while also investigating the mediating role of financial risk tolerance and the moderator effect of emotional intelligence.

Methods: The study collects time-lagged data from 389 financially independent individual investors from leading educational institutes in Pakistan. Data are analysed using SmartPLS (v 3.

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