Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package Integration.

As stacking technologies, such as 2.5D and 3D packages, continue to accelerate in advanced semiconductor components, the singulation and thinning of Si wafers are becoming increasingly critical. Despite their importance in producing thinner and more reliable Si chips, achieving high reliability remains a challenge, and comprehensive research on the effects of these processing techniques on Si chip integrity is lacking.

Parental perception of optimal surgical age for correction of cryptorchidism: a multicenter surveillance study.

Objective: To perform a multicenter survey to determine how many parents understood the optimal time for surgical correction of cryptorchidism in children.

Methods: We enrolled 377 parents of patients who had recently undergone surgical correction of cryptorchidism. These parents were divided into 3 groups according to their indicated preference of the optimal patient age for surgical correction: group 1 (<1 year old, 39 parents, 10.