Source and mask optimization for stability of reticle and wafer stages.

The relative motion of the reticle stage and wafer stage caused by vibration during the scanning exposure process of the lithography machine is an important factor that affects the imaging quality under limited lithography ability. In this paper, the influence of the vibration of the lithography stage system on the lithography imaging quality is studied. The lithography model including the vibration error of the stage is taken into account in the framework of source and mask optimization (SMO).